Reviews Thermal Compound For Computers

Computer-Systems K5 PRO Viscous Thermal Paste for Thermal pad Replacement 10g (iPhone, Apple iMac, Sony PS4 & PS3, Xbox, Acer Aspire etc)

  • K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and GPUs of various computers including iPhone, Acer Aspire 6930 , Apple iMac A1311 video boards. This is the only comercially avaliable product at the moment that can replace the gummy thermal paste that is originally used by Apple..
  • K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
  • K5-PRO has thermal conductivity K>5,3 W/m.K (at least 3 times higher than common thermal pads that are used on computers and comercial electronics) Computer Systems materials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014).
  • K5-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 250 degrees (Celcium) and has a long operational life time (practically infinite).
  • Expiration date: No expiration date (new formula). Infinite storage / service life. Protect from frost and dust.
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CoolerCube Thermal Paste, 3g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material

  • [UNIQUE PERFORMANCE]: high thermal conductivity (12.8 W/m.K), balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability and improve the thermal conductivity of contact surface, ensure heat dissipated quickly & efficiently..
  • [SAFE APPLICATION]: non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges and corrosion damage to the radiator bottom..
  • [HIGH DURABILITY]: high stability & reliability polysynthetic thermal compound, at least 5 years last without addtional apply again..
  • [EASY TO USE]: widely used for CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices, suitable for beginners..
  • [WHAT YOU GET]: 3 grams silicon thermal compound, spatula, scraper, clean package. Refund / Replacement services if delivery damanged..
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Thermal Paste 2g CPU Thermal Compound Paste Heatsink Paste for All Coolers CPU GPU IC Processor Carbon Based High Performance Thermal Interface Material

  • [UNIQUE PERFORMANCE]: high thermal conductivity (12.8 W/m.K), balance thermal resistance and viscosity can keep mushy for a long time, which enhance....
  • [SAFE APPLICATION]: non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges and....
  • [HIGH DURABILITY]: high stability & reliability polysynthetic thermal compound, at least 5 years last without addtional apply again..
  • [EASY TO USE]: widely used for CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices, suitable for beginners..
  • [WHAT YOU GET]: 2 grams silicon thermal compound, spatula, scraper, clean package. Refund / Replacement services if delivery damanged..
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Thermopad Thermal Grizzly Minus Pad 8 - Silicone Self-Adhesive Thermally Conductive Thermal Pad - Conducts Heat and Cools The Heating Elements of The Computer or Console 120 × 20 × 2,0 mm

  • Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles.
  • Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment.
  • The thermal conductive pad is ideally suited between the heat sink and the heating element.
  • Thanks to its unique composition, which consists of....
  • Thermal padding is characterized by a flexible structure and very high heat conductivity.
  • It compensates for even the smallest gaps between components.
  • Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate.
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TFX Thermal Compound Paste 14.3 W/Mk, Carbon Based High Performance, Heatsink Paste, for All CPU Coolers, 2 g with Tool

  • [HIGH THERMAL CONDUCTIVITY]: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently..
  • [SAFE APPLICATION]: The TFX is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards..
  • [HIGH DURABILITY]: In contrast to metal and silicon thermal compound, the TFX does not compromise over time..
  • [EASY TO APPLY]: With an ideal consistency, the TFX is very easy to use, even for beginners..
  • [THERMAL COMPOUND]: Formula, the TFX guarantees exceptional heat dissipation from the components and supports the stability needed to push your system to its limit..
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Thermopad Thermal Grizzly Minus Pad 8 - Silicone Self-Adhesive Thermally Conductive Thermal Pad - Conducts Heat and Cools The Heating Elements of The Computer or Console 120 × 20 × 1,0 mm 2 Units

  • Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles.
  • Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment.
  • The thermal conductive pad is ideally suited between the heat sink and the heating element.
  • Thanks to its unique composition, which consists of....
  • Thermal padding is characterized by a flexible structure and very high heat conductivity.
  • It compensates for even the smallest gaps between components.
  • Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate.
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TF8 Thermal Compound Paste 13.8 W/mK Carbon Based High Performance Heatsink Paste CPU for All Coolers Interface Material 2 Grams with Tool

  • [HIGH THERMAL CONDUCTIVITY]: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat....
  • [SAFE APPLICATION]: The TF8 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to....
  • [HIGH DURABILITY]: In contrast to metal and silicon thermal compound, the TF8 does not compromise over time. Once applied, you do not need to apply it....
  • [EASY TO APPLY]: With an ideal consistency, the TF8 is very easy to use, even for beginners..
  • [THERMAL COMPOUND]: Formula, the TF8 guarantees exceptional heat dissipation from the components and supports the stability needed to push your system....
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Thermal Paste, SYY 4 Grams CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, 2022 New Formula Carbon Based Easy to Apply, Thermal Interface Material, CPU Thermal Paste

  • ...t transfer between electronic components,and effectively cool the temperature down in seconds.Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, and also serve as insulation, shock absorption and sealing Equal effect..
  • ✔：Widely Used：Perfectly replaces traditional heatsink compound grease paste, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, 3d printerauto, mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
  • ✔：Good Cooling, Insulation, Thermal Conductivity, Wear Resistant, Non Conductive, Antistatic,Fire Retardant, Heat Resistance, High Temperature Resistance, Compression, Buffering, Etc..
  • ✔：Super Reliable Durable: In -40 ℃ -200 ℃ Range Does Not Melt, Good Stability, No Toxic, Odorless,No Corrosion,No Stimulation,No Damage To Metal Materials.It Can Be Arbitrarily Cut Size,Easy To Install, Replaces Traditional Heatsink Compound Grease Paste..
  • ✔：Thermal Silicone Pad Has A Thermal Conductivity Of 12 W/mk, Dimension 100x100x1mm, the thermal pads can be cut freely according to your needs, ​perfect to filled contact surfaces gap,we committed to provide superior thermal pads, easy to install, feel free to contact us ....
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30 Pieces 2.6 x 0.8 Inch Silicone Thermal Pad Reusable Thermal Conductive Silicone Pad Each Thick for Gpu Heatsink CPU Chip Heat Conduction or LED Heat Conduction (Light Blue)

  • Thermal Conductivity: quality thermal silica gel material with 6.0 walt/ thermal conductivity, our thermal pad nicely improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
  • Safety and Stability: electrical insulation, in -40 degree Centigrade - 200 degree Centigrade will not melt, wear-proof, anti-static, fire retardant, buffering, reliable, odorless, no corrosion, no stimulation, no damage to metal materials.
  • Suitable Size: the thermal pads are about 2.6 x 0.8 inch, totally 30 pieces suitable to fill contact surfaces gap, a nice assistant for both beginners and professionals.
  • Easy to Install: you can select the most suitable thickness and cut the required sizes.
  • Appropriate replacement for traditional heat sink compound grease paste.
  • Widely Application: nicely replaces traditional heatsink compound grease paste, suitable for control board, motor, electronics, CPU, GPU, heat sink, power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC and any cooling modules.
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